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25 March 2005 Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application
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Abstract
A vertically interconnected structure is a key feature of a photonic integrated circuit application, like an optical printed circuit board. Conventional vertical interconnecting structures have a 45 degree mirror, with or without metal coating to enhance its reflectance. We have designed a curved-shape semi-spherical type vertical interconnecting structure to enhance vertical interconnecting efficiency, and also developed simple fabrication procedure to realize it.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Min-Woo Lee, Chul-Hyun Choi, Soo-Beom Jo, Beom-Hoan O, Seung-Gol Lee, Se-Geun Park, and El-Hang Lee "Design and fabrication of a polymer-based micron-scale semispherical vertical interconnecting structure for 3D photonic integrated circuit application", Proc. SPIE 5729, Optoelectronic Integrated Circuits VII, (25 March 2005); https://doi.org/10.1117/12.592134
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