25 March 2005 Hybrid organic-inorganic optoelectronic subsystems on a chip
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We report on hybrid organic-inorganic optoelectronic sysbsystems that integrate passive and active optical functions. The integration approaches involve various levels of hybridization, from splicing of pigtailed elements, to chip-to-chip attachment, to hybrid on-chip integration involving grafting and flip-chip mounting, and finally to true heteroepitaxy. The materials integrated include polymer, silica, silicon, silicon oxynitride, lithium niobate, indium phosphide, gallium arsenide, yttrium iron garnet, and neodymium iron boron. The functions enabled by this hybridization approach span the range of functions needed in optical circuitry, while using the highest-performance material system for each element. We demonstrate a number of hybrid subsystems, including fully reconfigurable optical add/drop multiplexers and tunable optical transmitters.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Louay Eldada, Louay Eldada, Junichiro Fujita, Junichiro Fujita, Antonije Radojevic, Antonije Radojevic, Reinald Gerhardt, Reinald Gerhardt, Tomoyuki Izuhara, Tomoyuki Izuhara, } "Hybrid organic-inorganic optoelectronic subsystems on a chip", Proc. SPIE 5729, Optoelectronic Integrated Circuits VII, (25 March 2005); doi: 10.1117/12.598891; https://doi.org/10.1117/12.598891


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