Paper
7 March 2005 Challenges for on-chip optical interconnects
Kenneth C. Cadien, Miriam R. Reshotko, Bruce A. Block, Audrey M. Bowen, David L. Kencke, Paul Davids
Author Affiliations +
Abstract
As integrated circuit interconnect dimensions continue to shrink and signaling frequencies increase, interconnect performance degrades. The performance degradation is due to several factors such as power consumption, cross-talk, and signal attenuation. On-chip optical interconnects are a potential solution to these scaling issues because they offer the promise of providing higher bandwidth. In this paper, progress on the major on-chip optical building blocks will be reviewed. It will be shown that significant advances have been made in the design and fabrication of waveguides, detectors, and couplers. However, major challenges in high speed electrical to optical conversion and signaling remain.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kenneth C. Cadien, Miriam R. Reshotko, Bruce A. Block, Audrey M. Bowen, David L. Kencke, and Paul Davids "Challenges for on-chip optical interconnects", Proc. SPIE 5730, Optoelectronic Integration on Silicon II, (7 March 2005); https://doi.org/10.1117/12.591163
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CITATIONS
Cited by 16 scholarly publications.
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KEYWORDS
Waveguides

Sensors

Silicon

Modulators

Optical interconnects

Photodetectors

Aluminum

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