You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
7 March 2005Challenges for on-chip optical interconnects
As integrated circuit interconnect dimensions continue to shrink and signaling frequencies increase, interconnect performance degrades. The performance degradation is due to several factors such as power consumption, cross-talk, and signal attenuation. On-chip optical interconnects are a potential solution to these scaling issues because they offer the promise of providing higher bandwidth. In this paper, progress on the major on-chip optical building blocks will be reviewed. It will be shown that significant advances have been made in the design and fabrication of waveguides, detectors, and couplers. However, major challenges in high speed electrical to optical conversion and signaling remain.
The alert did not successfully save. Please try again later.
Kenneth C. Cadien, Miriam R. Reshotko, Bruce A. Block, Audrey M. Bowen, David L. Kencke, Paul Davids, "Challenges for on-chip optical interconnects," Proc. SPIE 5730, Optoelectronic Integration on Silicon II, (7 March 2005); https://doi.org/10.1117/12.591163