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14 March 2005 Development of an electro-optical MCM to produce a multichannel transceiver using VCSEL arrays
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Abstract
This article describes the implementation of VCSELs as light sources for a chip-scale, highly dense multi-channel transmitter and receiver. The VCSELs are implemented using flip chip technology, as part of a hybrid process for the fabrication of an integrated photonic chip, using standard semi-conductor processes. The results as published indicate that integrated photonic chips may be applicable for various high speed datacom applications where copper use is restricted.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Pierre Avner Badihi, Sylvie Rockman, Hanan Yinnon, and Yaniv Rotem "Development of an electro-optical MCM to produce a multichannel transceiver using VCSEL arrays", Proc. SPIE 5737, Vertical-Cavity Surface-Emitting Lasers IX, (14 March 2005); https://doi.org/10.1117/12.601049
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