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14 March 2005 Flip chip VCSEL arrays on transparent substrates
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Abstract
In this report, we will discuss a method utilized by Emcore to flip-chip VCSEL die arrays onto transparent substrates, which contain integrated lensing and hybrid drive circuits. This process enables very dense hybrid packages.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bryan Gregory and Randy Wickman "Flip chip VCSEL arrays on transparent substrates", Proc. SPIE 5737, Vertical-Cavity Surface-Emitting Lasers IX, (14 March 2005); https://doi.org/10.1117/12.601943
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