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6 May 2005 Alignment issues in a modular hot embossing system
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The idea of subdividing the conventional hot embossing process into subsequent process steps is introduced as a modular hot embossing concept. Based on the EVG 520HE the process is separated into modules so that typical temperature cycle times can be circumvented because the imprint is carried out as an isothermal embossing process where the applied pressure is released at a temperature above Tg. Before detachment of stamp and imprinted substrate cooling is applied in a separate module. The full benefit of such a modular concept is achieved when every module is equipped with its own embossing tool and therefore with its own template. We have investigated a new way of preparing working-stamps, which are cost-efficient namely the polymeric replications of Si templates. We have chosen mr-L 6000, an UV curable imprint resist as a working-stamp material. It was possible to obtain a complete cross-link without PEB, which is beneficial with respect to pattern fidelity conservation. Furthermore XPS measurements have shown that a silanization of the cured resist is possible to serve as an anti-adhesion layer. IR alignment as a part of the modular concept and its issues have been discussed on the basis of the EVG450 bond aligner by using Si templates and Si substrates. It is shown that an embossing tool enabling alignment may affect pattern transfer.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. Wissen, T. Glinsner, N. Bogdanski, H.-C. Scheer, and G. Gruetzner "Alignment issues in a modular hot embossing system", Proc. SPIE 5751, Emerging Lithographic Technologies IX, (6 May 2005);

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