Translator Disclaimer
6 May 2005 Approximation of three dimensional mask effects with two dimensional features
Author Affiliations +
As an important resolution enhancement technique (RET), alternating aperture phase shift masks (AAPSM) has been widely adopted in 90 nm technology node and beyond. Mask topographical effect due to the 3D nature of the shifter features is becoming an increasingly important factor in lithography modeling. Rigorous 3D modeling of PSM is very computationally demanding thus impractical for full chip optical proximity correction (OPC). Here we introduce an alternative approach employing boundary layers to effectively approximate the 3D mask effect. We will present the model calibration versus real wafer data using the boundary layers and the corresponding OPC correction flow.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Min Bai, Lawrence S. Melvin III, Qiliang Yan, James P. Shiely, Bradley J. Falch, Chong-Cheng Fu, and Ruoping Wang "Approximation of three dimensional mask effects with two dimensional features", Proc. SPIE 5751, Emerging Lithographic Technologies IX, (6 May 2005);


Modeling metrology for calibration of OPC models
Proceedings of SPIE (March 24 2016)
Large scale model of wafer topography effects
Proceedings of SPIE (March 22 2011)
Full chip OPC and verification with a fast mask 3D...
Proceedings of SPIE (March 23 2011)
SEM-contour based mask modeling
Proceedings of SPIE (March 07 2008)

Back to Top