6 May 2005 E-beam direct-write lithography for the 45nm node using the novel STEAG HamaTech single substrate coat-bake-develop ModuTrack
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Abstract
The rising demand for processing small charges of ASICs, FPGAs or optolectronic devices at reduced costs promotes the application of e-beam direct-write lithography. This technology requires automated tools which integrate the overall processing sequence: coating, baking, developing, wet etching, stripping and cleaning. These tools should also enable clustering with e-beam writers and dry etchers for seamless processing. The novel integrated STEAG HamaTech ModuTrack track system enables automated processing of a batch of single substrates like wafers or photomasks, while for each substrate different processing methods and sequences may be chosen. The processing modules may also be operated individually. This integrated tool concept is demonstrated referring to the recently installed 8" wafer and 6" photomask ModuTrack at ITRI (Industrial Technology Research Institute of Taiwan), where the process development for wafer e-beam direct-write (EBDW) lithography and photomask processing is ongoing. The processing modules deliver outstanding capabilities, like coating resist with 50nm thickness within a total range of 1% uniformity, and developing 45nm resist dense lines both uniform and repeatable.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L. Berger, L. Berger, W. Dieckmann, W. Dieckmann, C. Krauss, C. Krauss, P. Dress, P. Dress, J. Waldorf, J. Waldorf, C. Y. Cheng, C. Y. Cheng, S. L. Wei, S. L. Wei, W. S. Chen, W. S. Chen, M. J. Kao, M. J. Kao, M. J. Tsai, M. J. Tsai, "E-beam direct-write lithography for the 45nm node using the novel STEAG HamaTech single substrate coat-bake-develop ModuTrack", Proc. SPIE 5751, Emerging Lithographic Technologies IX, (6 May 2005); doi: 10.1117/12.596484; https://doi.org/10.1117/12.596484
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