10 May 2005 Influence of material on process focus budget and process window of 80nm DRAM devices
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Abstract
A new type of focus monitoring mask, multiple phase-phase shift mask (MP-PSM), has been designed, and the focus budget of a lithography process was investigated. MP-PSM was used to identity focus controllability of several scanners and was able to detect focus change smaller then 20 nm. We also investigated the difference in focus variation across a wafer between double side polished wafers and single side polished wafers. A comparative study of focus controllability of a scanner using 80 nm node DRAM pattern showed that the focus controllability of a scanner was directly affected by wafer type. Using double side polished wafers increased the process window.
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Sung Won Choi, Sung Won Choi, SukJoo Lee, SukJoo Lee, Jangho Shin, Jangho Shin, Sang-Gyun Woo, Sang-Gyun Woo, HanKu Cho, HanKu Cho, Joo-Tae Moon, Joo-Tae Moon, } "Influence of material on process focus budget and process window of 80nm DRAM devices", Proc. SPIE 5752, Metrology, Inspection, and Process Control for Microlithography XIX, (10 May 2005); doi: 10.1117/12.600166; https://doi.org/10.1117/12.600166
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