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4 May 2005 Advanced microlithography process with multiple-chemical trim technology
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Shrinkage technologies have attracted much more attention recently. The main shrinkage techniques are either to generate a thermal flow in the photo-resist with a high-temperature baking process, or to form a top layer with mixing bake treatment. In this paper, United Microelectronics Corporation (UMC) introduces a new shrinkage technology called MCTP (multiple Chemical Trim Process) and present the experimental results for our evaluation of the MCTP to implement the 90nm gate layer. Furthermore, this paper focuses on the correlation between developer process and mixing bake treatment, which has greatly benefits process window and leads to good line-edge roughness (LER) performance, especially for line-end shortening.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Te Hung Wu, Ling Chieh Lin, and C. L. Lin "Advanced microlithography process with multiple-chemical trim technology", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005);

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