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4 May 2005 Material design for immersion lithography with high refractive index fluid (HIF)
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Abstract
ArF immersion lithography is considered as the most promising next generation technology which enables to a 45 nm node device manufacturing and below. Not only depth of focus enlargement, immersion lithography enables to use hyper numerical aperture (NA) larger than 1.0 and achieve higher resolution capability. For 193nm lithography, water is an ideal immersion fluid, providing suitable refractive index and transmission properties. Furthermore the higher refractive index fluid is expected to provide a potential extension of optical lithography to the 32 nm node. This paper describes the material design for immersion lithography with high refractive index fluid. We have developed promising high refractive index fluids which satisfy the requirement for immersion fluid by screening wide variety of organic compounds. The physical and chemical properties of this high refractive index fluid are discussed in detail. Also the topcoat material which has good matching with high refractive index fluid is developed. While this topcoat material is soluble into aqueous TMAH developer, it does not dissolve into water or high refractive index fluid and gives suitable contact angle for immersion scan exposure. Immersion exposure experiments using high refractive index fluid with and w/o topcoat material was carried out and its lithographic performance is presented in this paper.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takashi Miyamatsu, Yong Wang, Motoyuki Shima, Shiro Kusumoto, Takashi Chiba, Hiroki Nakagawa, Katsuhiko Hieda, and Tsutomu Shimokawa "Material design for immersion lithography with high refractive index fluid (HIF)", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); https://doi.org/10.1117/12.599165
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