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4 May 2005 Mechanical strength of resist film analyzed by tip indentation method
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Mechanical strength of resist film processed by various post apply bake (PAB) conditions were measured utilizing the tip indentation method using atomic force microscope (AFM). With the tip indentation method, we could quantify mechanical strength of resist film in terms of “degree of softening.” It was found that PAB at our standard baking temperature tends to lead to softening of the resist film which is considered due to existence of softening point of the resist polymer. Also changing baking time at this temperature showed very complicated softness behavior. By control of baking temperature, we could obtain harder resist film as baking time becomes longer. Further analysis of these resist film properties by ellipsometry suggested that changes in mechanical strength occur by the evaporation of the resist solvent and/or structure changes inside the resist film, depending upon baking conditions.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Osamu Tamada, Masakazu Sanada, Atsushi Ishikawa, Takayoshi Niiyama, and Akira Kawai "Mechanical strength of resist film analyzed by tip indentation method", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005);

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