Photoresists for CO2-based next-generation microlithography

Mary Kate Boggiano; Colin Wood; Joseph M. DeSimone

doi:10.1117/12.599565

4 May 2005 Photoresists for CO₂-based next-generation microlithography

Mary Kate Boggiano, Colin Wood, Joseph M. DeSimone

Proceedings Volume 5753, Advances in Resist Technology and Processing XXII; (2005) https://doi.org/10.1117/12.599565
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

Two routes have been pursued toward the fabrication of photoresists for next-generation microlithography, using condensed carbon dioxide as the processing solvent. Addition polymers containing a norbornyl backbone were synthesized to include fluorinated moieties and chemical amplification switching groups. Other polymers, synthesized free radically in condensed CO₂, include partially fluorinated backbones. These materials have been characterized and their lithographic properties evaluated. Solubility differences between exposed and non-exposed resist have been observed in these novel systems, which should provide the necessary contrast for high-resolution imaging.

Citation Download Citation

Mary Kate Boggiano, Colin Wood, and Joseph M. DeSimone "Photoresists for CO₂-based next-generation microlithography", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); https://doi.org/10.1117/12.599565

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