5 May 2005 Building an infrastructure for parametric yield analysis: concept and implementation of a DFM platform (Invited Paper)
Author Affiliations +
Abstract
There is a growing realization of the need for highly integrated solutions enabled by new bi-directional data 'pipes' between design and manufacturing. Traditional EDA applications should be able to communicate and collaborate with yield analysis software. Simply adding such capabilities to existing EDA applications is not feasible. Thus, there is a need for an infrastructure that would enable such interaction in a standard way. We call this infrastructure the DFM Platform. In this article we present new approach to building such a platform. Brief descriptions of potential applications follow the platform architecture. "Via analysis" application includes test chips capabilities, critical area and critical parameter analysis to predict yield for a real design. The "DFM Cell Grading" module applies the concept of DFM to IP Libraries.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John Gookassian, Bob Pack, Mitch Heins, John Garcia, Hitendra Divecha, Brian Gordon, Dean Frazier, Dan White, Gurgen Lachinyan, Brian Dillon, Christophe Suzor, Anthony Adamov, Kyung-Youl Min, Sergei Bakarian, Rafik Marutyan, Victor Boksha, "Building an infrastructure for parametric yield analysis: concept and implementation of a DFM platform (Invited Paper)", Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.600261; https://doi.org/10.1117/12.600261
PROCEEDINGS
11 PAGES


SHARE
Back to Top