5 May 2005 Integrating DfM components into a cohesive design-to-silicon solution (Invited Paper)
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Two primary tracks of DfM, one originating from physical design characterization, the other from low-k1 lithography, are described. Examples of specific DfM efforts are given and potentially conflicting layout optimization goals are pointed out. The need for an integrated DfM solution than ties together currently parallel DfM efforts of increasing sophistication and layout impact is identified and a novel DfM-enabling design flow is introduced.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lars Liebmann, Lars Liebmann, Dan Maynard, Dan Maynard, Kevin McCullen, Kevin McCullen, Nakgeuon Seong, Nakgeuon Seong, Ed Buturla, Ed Buturla, Mark Lavin, Mark Lavin, Jason Hibbeler, Jason Hibbeler, } "Integrating DfM components into a cohesive design-to-silicon solution (Invited Paper)", Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); doi: 10.1117/12.604723; https://doi.org/10.1117/12.604723


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