Paper
5 May 2005 Model-based verification for first time right manufacturing
James A. Bruce, Edward W. Conrad, Gregory J. Dick, D. John Nickel, Jacek G. Smolinski
Author Affiliations +
Abstract
In this paper we will describe the implementation of a system for model-based verification of post OPC data into a manufacturing data flow. Verification is run automatically, upon OPC completion, on the critical levels for every chip run in the 130nm node and beyond to ensure that OPC errors are caught before hardware is committed in the manufacturing line. The checks are derived from the design rule manual, and are written to cover the intent of the design rules. Some of the challenges of implementing a robust model-based verification solution for manufacturing will be discussed, including resource requirements, data management, cycle time, and the creation of a closed loop system to ensure that verification is completed on all chips. The benefits of implementing model-based verification include improved feedback to lithography and OPC teams, enabling constant improvement, as well as increasing the probability of first time right manufacturing of a new chip design.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James A. Bruce, Edward W. Conrad, Gregory J. Dick, D. John Nickel, and Jacek G. Smolinski "Model-based verification for first time right manufacturing", Proc. SPIE 5756, Design and Process Integration for Microelectronic Manufacturing III, (5 May 2005); https://doi.org/10.1117/12.600552
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CITATIONS
Cited by 14 scholarly publications.
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KEYWORDS
Optical proximity correction

Lithography

Photomasks

Manufacturing

Data modeling

Semiconducting wafers

Model-based design

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