19 May 2005 A fully thermoelectromechanically coupled FE analysis for the dynamic behavior of smart plates using discrete-layer kinematics
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Abstract
Due to the extended application of piezoelectrics into a number of high performance structures, the necessity for accurate analysis of their behavior is of critical importance. In this work the dynamic analysis of a composite plate incorporating piezoelectric layers is presented. A 4-node plate finite element is developed. Discrete layer kinematic assumptions in combination with a thermal-electrical-mechanical coupled formulation takes place. This formulation enables the investigation of the response of a structure under the influence of different thermal and electrical conditions. Additionally, in order to investigate whether the kinematics assumptions implemented here are capable of capturing with accuracy the dynamic performance of both thin and thick structures, plates of different thicknesses are investigated.
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G. Giannopoulos, G. Giannopoulos, J. Vantomme, J. Vantomme, } "A fully thermoelectromechanically coupled FE analysis for the dynamic behavior of smart plates using discrete-layer kinematics", Proc. SPIE 5757, Smart Structures and Materials 2005: Modeling, Signal Processing, and Control, (19 May 2005); doi: 10.1117/12.599423; https://doi.org/10.1117/12.599423
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