Paper
8 December 2004 Improve the charge stability of SiO2 films by plasma treatment and ion implantation
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Proceedings Volume 5774, Fifth International Conference on Thin Film Physics and Applications; (2004) https://doi.org/10.1117/12.607379
Event: Fifth International Conference on Thin Film Physics and Applications, 2004, Shanghai, China
Abstract
The plasma surface treatment and ion implantation are utilized to improve the stability of charge storage of the SiO2 film electret. The effects are obviously different when the different kinds of plasma are used, and when the ions with different energy and dose implanted into the SiO2 film. To the plasma treatment, the best effect is obtained with argon plasma. After argon plasma treatment with the arcing at 700V and 15 minutes for the SiO2 film electret, its charge storage has a similar stability as one after the chemical surface modification. To the ion implantation method, the remanent surface potential is 95%of primary one after ion implantation by Ar+ with a energy of 150KeV and a dose of 2E11/cm2. The experimental results show that argon plasma treatment and Ar+ implantation change the hydrophilicity of the surface of SiO2 film and prevent the electret charge from leaking, which is owning to the increase of the surface conductance by the vapor adherence on the surface. In addition, the plasma bombardment and ion implantation induce traps into the near-surface, which make the trapped charge stored stable.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ningyi Yuan and Jinhua Li "Improve the charge stability of SiO2 films by plasma treatment and ion implantation", Proc. SPIE 5774, Fifth International Conference on Thin Film Physics and Applications, (8 December 2004); https://doi.org/10.1117/12.607379
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KEYWORDS
Argon

Plasma

Plasma treatment

Ion implantation

Ions

Polymers

Silicon

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