14 February 2005 Measurement of residual stresses using a radial in-plane digital speckle pattern interferometer and local heating: recent advances
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Proceedings Volume 5776, Eighth International Symposium on Laser Metrology; (2005) https://doi.org/10.1117/12.611743
Event: Eighth International Conference on Laser Metrology, 2005, Merida, Mexico
Abstract
This paper presents an application of a radial in-plane digital speckle pattern interferometer and a local heating combined system to measure residual stresses in ductile materials. The system allows the local heating of a small spot and the measurement of the radial in-plane displacement field generated around it. In order to quantify the residual stresses from the measured displacement field, the thermomechancial problem is simulated using the finite element method and a modified hole-drilling model is applied. The performance of the system is evaluated by measuring the stress generated by a preloaded specimen. It is shown that the combined system can measure residual stresses with a typical error of approximately 5%.
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Matías R. Viotti, Armando Albertazzi Gonçalves, Guillermo H. Kaufmann, "Measurement of residual stresses using a radial in-plane digital speckle pattern interferometer and local heating: recent advances", Proc. SPIE 5776, Eighth International Symposium on Laser Metrology, (14 February 2005); doi: 10.1117/12.611743; https://doi.org/10.1117/12.611743
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