23 March 2005 Laser cutting of CVD diamond wafers
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Proceedings Volume 5777, XV International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers; (2005) https://doi.org/10.1117/12.611274
Event: XV International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers, 2004, Prague, Czech Republic
Abstract
CVD diamond has many outstanding physical properties. Because of its extreme hardness, this material is difficult to cut and polish and laser cutting and shaping is a technology of choice. Thick polycrystalline diamond layers were deposited by microwave plasma enhanced chemical vapor deposition on silicon substrates. After synthesis, the silicon substrate was dissolved in an acid mixture and diamond wafer has to be cut into desired shapes according to their future use. With LASAG Nd:YAG pulsed laser system KLS 246-102 we found cutting parameters for different thickness of diamond wafers from 0,1 mm to 0,7 mm. A special support with connection to vacuum was developed to keep small and light parts fixed during processing. To avoid undesirable cracks, laser scribing was used at first. Laser pulse with energy 30 mJ-200 mJ according wafer thickness and velocity 3mm.s-1-15 mm.s-1 goes two or four times along cutting lines. High temperature is the origin of black graphite layers, where absorption of laser radiation continues. Peak power contained in 0,2 ms pulse was up to 1000 W. Developed method helps to prepare CVD diamond samples of any desired shape.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hana Chmelickova, Hana Chmelickova, Milan Vanecek, Milan Vanecek, Jan Rosa, Jan Rosa, Martin Stranyanek, Martin Stranyanek, } "Laser cutting of CVD diamond wafers", Proc. SPIE 5777, XV International Symposium on Gas Flow, Chemical Lasers, and High-Power Lasers, (23 March 2005); doi: 10.1117/12.611274; https://doi.org/10.1117/12.611274
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