Analysis tool and methodology design for electronic vibration stress understanding and prediction

Sheng-Jen Hsieh; Robert L. Crane; Shamachary Sathish

doi:10.1117/12.605448

28 March 2005 Analysis tool and methodology design for electronic vibration stress understanding and prediction

Sheng-Jen Hsieh, Robert L. Crane, Shamachary Sathish

Proceedings Volume 5782, Thermosense XXVII; (2005) https://doi.org/10.1117/12.605448
Event: Defense and Security, 2005, Orlando, Florida, United States

Abstract

The objectives of this research were to (1) understand the impact of vibration on electronic components under ultrasound excitation; (2) model the thermal profile presented under vibration stress; and (3) predict stress level given a thermal profile of an electronic component. Research tasks included: (1) retrofit of current ultrasonic/infrared nondestructive testing system with sensory devices for temperature readings; (2) design of software tool to process images acquired from the ultrasonic/infrared system; (3) developing hypotheses and conducting experiments; and (4) modeling and evaluation of electronic vibration stress levels using a neural network model. Results suggest that (1) an ultrasonic/infrared system can be used to mimic short burst high vibration loads for electronics components; (2) temperature readings for electronic components under vibration stress are consistent and repeatable; (3) as stress load and excitation time increase, temperature differences also increase; (4) components that are subjected to a relatively high pre-stress load, followed by a normal operating load, have a higher heating rate and lower cooling rate. These findings are based on grayscale changes in images captured during experimentation. Discriminating variables and a neural network model were designed to predict stress levels given temperature and/or grayscale readings. Preliminary results suggest a 15.3% error when using grayscale change rate and 12.8% error when using average heating rate within the neural network model. Data were obtained from a high stress point (the corner) of the chip.

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Sheng-Jen Hsieh, Robert L. Crane, and Shamachary Sathish "Analysis tool and methodology design for electronic vibration stress understanding and prediction", Proc. SPIE 5782, Thermosense XXVII, (28 March 2005); https://doi.org/10.1117/12.605448

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KEYWORDS

Neural networks

Amplifiers

Electronic components

Sensors

Temperature metrology

Algorithm development

Lead

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