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18 May 2005 Weibull statistical analysis of sapphire strength improvement through chemomechanical polishing
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Abstract
Signifigant enhancements of the flexural strength of a- and c- plane sapphire by means of "super polishing" was first reported be McHargue and Snyder [Proc. SPIE 2013, 135 (1993)]. The improvement was attributed to the removal of residual mechanical polishing damage. More recently, a comprehensive series of eperiements was carried out by Crystal Systems for the specific purpose of assessing the effects of various polishing procedures on the high-temperature strength of c-plane sapphire. Subsequent testing at room temperature confirmed that chemomechanical polishing improves both the effective strength and the strength distriution. In this contribution we take advantage of the methodology previously used by Klein et al. [Opt. Eng. 41, 3151 (2002)] to perform a correct Weibull statistical analysis of biaxial flexure-strength data genenrated in the course of Crystal Systems' investigations. We demonstrate that chemomechanical polishing procedures can improve the high-temperature characteristic strength of c-plane sapphire by 150% and the room-temperature Weibull modulus by 100%.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Claude A. Klein and Frederick Schmid "Weibull statistical analysis of sapphire strength improvement through chemomechanical polishing", Proc. SPIE 5786, Window and Dome Technologies and Materials IX, (18 May 2005); https://doi.org/10.1117/12.603271
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