Flexible reflective and emissive display integration and manufacturing

Gregory B. Raupp; Shawn M. O'Rourke; David R. Allee; Sameer Venugopal; Edward J. Bawolek; Douglas E. Loy; Scott K. Ageno; Barry P. O'Brien; Steve Rednour; Ghassan E. Jabbour

doi:10.1117/12.609033

25 May 2005 Flexible reflective and emissive display integration and manufacturing (Invited Paper)

Gregory B. Raupp, Shawn M. O'Rourke, David R. Allee, Sameer Venugopal, Edward J. Bawolek, Douglas E. Loy, Scott K. Ageno, Barry P. O'Brien, Steve Rednour, Ghassan E. Jabbour

Author Affiliations +

Proceedings Volume 5801, Cockpit and Future Displays for Defense and Security; (2005) https://doi.org/10.1117/12.609033
Event: Defense and Security, 2005, Orlando, Florida, United States

Abstract

The U.S. Army, Arizona State University (ASU) and commercial industry have joined forces to create the Flexible Display Center (FDC) at Arizona State University, a large-scale collaborative venture designed to rapidly advance flexible display technology to the brink of commercialization. The Center has completed its startup phase and is now engaged in an intensive and aggressive applied research and development program that will produce high quality, high performance active matrix reflective and emissive flexible display technology demonstrators (TDs). Electrophoretic ink and cholesteric liquid crystals have been selected as Center reflective imaging layer technologies; these technologies are attractive because they are fully reflective and bistable (extremely low power) and because the materials are environmentally robust and intrinsically rugged. Organic light emitting devices (OLEDs) have been chosen as the emissive imaging layer technology. These three electro-optic subsystems will be integrated with a flexible a-Si thin film transistor active matrix backplane platform. We have created the integrated design, backplane fabrication, display assembly, test and evaluation capability to enable rapid cycles of learning and technology development. Backplane fabrication is currently accomplished on a 6” wafer scale pilot line linked to a Manufacturing Execution System and supported by a comprehensive suite of in-fab metrology tools. We are currently installing a GEN II pilot line, with qualified operation slated for 2006. This line will be used to demonstrate process and display form factor capability, while providing high yield low volume manufacturing of pilot-scale levels of technology demonstrators for the Army and our commercial partners.

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Gregory B. Raupp, Shawn M. O'Rourke, David R. Allee, Sameer Venugopal, Edward J. Bawolek, Douglas E. Loy, Scott K. Ageno, Barry P. O'Brien, Steve Rednour, and Ghassan E. Jabbour "Flexible reflective and emissive display integration and manufacturing (Invited Paper)", Proc. SPIE 5801, Cockpit and Future Displays for Defense and Security, (25 May 2005); https://doi.org/10.1117/12.609033

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