1 July 2005 Wafer level optoelectronic device packaging using MEMS (Invited Paper)
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The emergence of vertical cavity surface emitting laser (VCSEL) and photo diode (PD) arrays has given scope for the development of many applications such as high speed data communication. Further increase in performance can be obtained by the inclusion of micro-mirrors and microlens in the optical path between these components. However, the lack of efficient assembly and alignment techniques has become bottlenecks for new products. In this paper, we present development of optical sub-assembly and metallic MEMS structures that enable in the massively parallel assembly and alignment of these components to form a single miniature package. VCSEL wafer was processed to have polymer pedestal and polymeric lens on top of it. Such optical sub assembly greatly increases coupling efficiency between the VCSEL and optical fibers. Multiple numbers of suspended MEMS serpentine springs made out of electroplated nickel have been fabricated on ceramic substrates. These springs serve for clamping and alignment of multiple numbers of optoelectronic components. They are designed to be self-aligning with alignment accuracies of less than 3 micron after final assembly. Electrical connection between the bond pads of VCSEL's and PD's to the electrical leads on the substrate has been demonstrated by molten solder inkjet printing into precisely designed MEMS mold structures. This novel massively parallel assembly process is substrate independent and relatively simple process. This technique will provide reliable assembly of optoelectronic components and miniature optical systems in low cost mass production manner.
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Arunkumar Nallani, Arunkumar Nallani, Ting Chen, Ting Chen, J.-B. Lee, J.-B. Lee, Donald Hayes, Donald Hayes, David Wallace, David Wallace, "Wafer level optoelectronic device packaging using MEMS (Invited Paper)", Proc. SPIE 5836, Smart Sensors, Actuators, and MEMS II, (1 July 2005); doi: 10.1117/12.608741; https://doi.org/10.1117/12.608741

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