Impact of package parasitics on crosstalk in mixed-signal ICs

Giorgio Boselli; Vincenzo Ferragina; Nicola Ghittori; Valentino Liberali; Guido Torelli; Gabriella Trucco

doi:10.1117/12.608638

30 June 2005 Impact of package parasitics on crosstalk in mixed-signal ICs

Giorgio Boselli; Vincenzo Ferragina; Nicola Ghittori; Valentino Liberali; Guido Torelli; Gabriella Trucco

Author Affiliations +

Proceedings Volume 5837, VLSI Circuits and Systems II; (2005) https://doi.org/10.1117/12.608638
Event: Microtechnologies for the New Millennium 2005, 2005, Sevilla, Spain

Abstract

This paper presents an approach for the analysis and the experimental evaluation of crosstalk effects due to current pulses drawn from voltage supplies in mixed analog-digital CMOS integrated circuits. A realistic model of bonding and package parasitics has been derived to study digital switching noise injected through bonding interconnections. Simulations results indicate that disturbances due to switching currents in digital blocks propagate through the substrate and affect analog voltages, thus degrading circuit performance. Test structures have been integrated into a test chip mounted with different technologies, in order to compare the measurements on test chips. Measurements confirm simulation results. Chip-on-board mounting technology has better performance with respect to chip-in-package, due to the reduction of parasitic elements.

Citation Download Citation

Giorgio Boselli, Giorgio Boselli, Vincenzo Ferragina, Vincenzo Ferragina, Nicola Ghittori, Nicola Ghittori, Valentino Liberali, Valentino Liberali, Guido Torelli, Guido Torelli, Gabriella Trucco, Gabriella Trucco, } "Impact of package parasitics on crosstalk in mixed-signal ICs", Proc. SPIE 5837, VLSI Circuits and Systems II, (30 June 2005); doi: 10.1117/12.608638; https://doi.org/10.1117/12.608638

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