30 June 2005 Impact of package parasitics on crosstalk in mixed-signal ICs
Author Affiliations +
This paper presents an approach for the analysis and the experimental evaluation of crosstalk effects due to current pulses drawn from voltage supplies in mixed analog-digital CMOS integrated circuits. A realistic model of bonding and package parasitics has been derived to study digital switching noise injected through bonding interconnections. Simulations results indicate that disturbances due to switching currents in digital blocks propagate through the substrate and affect analog voltages, thus degrading circuit performance. Test structures have been integrated into a test chip mounted with different technologies, in order to compare the measurements on test chips. Measurements confirm simulation results. Chip-on-board mounting technology has better performance with respect to chip-in-package, due to the reduction of parasitic elements.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Giorgio Boselli, Giorgio Boselli, Vincenzo Ferragina, Vincenzo Ferragina, Nicola Ghittori, Nicola Ghittori, Valentino Liberali, Valentino Liberali, Guido Torelli, Guido Torelli, Gabriella Trucco, Gabriella Trucco, } "Impact of package parasitics on crosstalk in mixed-signal ICs", Proc. SPIE 5837, VLSI Circuits and Systems II, (30 June 2005); doi: 10.1117/12.608638; https://doi.org/10.1117/12.608638


Back to Top