Transient electro-thermal investigations of interconnect structures exposed to mechanical stress

Stefan Holzer; Christian Hollauer; Hajdin Ceric; Stephan Wagner; Erasmus Langer; Tibor Grasser; Siegfried Selberherr

doi:10.1117/12.608414

30 June 2005 Transient electro-thermal investigations of interconnect structures exposed to mechanical stress

Stefan Holzer, Christian Hollauer, Hajdin Ceric, Stephan Wagner, Erasmus Langer, Tibor Grasser, Siegfried Selberherr

Proceedings Volume 5837, VLSI Circuits and Systems II; (2005) https://doi.org/10.1117/12.608414
Event: Microtechnologies for the New Millennium 2005, 2005, Sevilla, Spain

Abstract

Investigations of state-of-the-art integrated circuit designs clearly show that the temperature in interconnect structures is becoming the dominant and straitening factor for system performance. In this work we combine three-dimensional transient electro-thermal simulations with a finite element formulation of the thermo-mechanical stress problem in order to study the evolution and development of mechanical stress in complex layered interconnect structures at different operating conditions.

Citation Download Citation

Stefan Holzer, Christian Hollauer, Hajdin Ceric, Stephan Wagner, Erasmus Langer, Tibor Grasser, and Siegfried Selberherr "Transient electro-thermal investigations of interconnect structures exposed to mechanical stress", Proc. SPIE 5837, VLSI Circuits and Systems II, (30 June 2005); https://doi.org/10.1117/12.608414

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