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7 July 2005 Fabrication and integration of micro/nano-scale photonic devices and optical waveguide arrays for optical printed circuit board (O-PCB) and VLSI photonic applications (Invited Paper)
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Abstract
We report on the recent progresses of our work on the design, fabrication and integration of micro/nano-scale photonic devices and optical waveguide arrays for optical printed circuit boards (O-PCBs) and VLSI photonic applications. The waveguides are designed and fabricated by thermal embossing and ultraviolet (UV) radiated embossing of polymer materials. The photonic devices include vertically coupled surface emitting laser (VCSEL) microlasers, microlenses, 45-degree reflection couplers, directional couplers, arrayed waveguide grating structures, multimode interference (MMI) devices and photodetectors in micro/nano-scale. These de-vices are optically interconnected and integrated for O-PCB assembly and VLSI micro/nano-photonics. De-tailed procedures of fabricating and implementing these devices and assembly of O-PCB are described. The O-PCBs are to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We report on the result of the optical transmission performances of these as-sembled O-PCBs up to 2.5 Gbps and 10 Gbps. For the design, fabrication, and VLSI integration of nano-scale photonic devices, we used photonic crystal structures. Characteristics of these devices are also described.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
El-Hang Lee, S. G. Lee, B. H. O, S. G. Park, K. H. Kim, J. K. Kang, and Y. W. Choi "Fabrication and integration of micro/nano-scale photonic devices and optical waveguide arrays for optical printed circuit board (O-PCB) and VLSI photonic applications (Invited Paper)", Proc. SPIE 5840, Photonic Materials, Devices, and Applications, (7 July 2005); https://doi.org/10.1117/12.607909
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