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7 June 2005 New processing possibilities of materials by micro and nano precision laser machining for microelectronics applications
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Proceedings Volume 5850, Advanced Laser Technologies 2004; (2005) https://doi.org/10.1117/12.633706
Event: Advanced Laser Technologies 2004, 2004, Rome and Frascati, Italy
Abstract
The permanently development of microelectronics production by continuously increasing of devices densities meantime with corresponding decreasing of processing line till further submicronic range. The processing of huge diversity of materials as metals, polymers, ceramics, silicon, germanium, other materials III-Vs, glass, diamond, hard metal oxides, composites is need. On this paper will be presented our advanced studies and of experiments realized with very good results for a full range of those materials by micro and nanoprocessing for to realize the best accuracy, according with microelectronics technical requirements specified as below: 1. The microdrilling for microvias used for MCM's, MEMS and MOEMS application. 2. The high precision microcutting and scribing used for individual chips separation Isingulation on processed wafers of micro and optoelectronics applications 3. 2D I3D processing for microlens, microlens array and microalveoles fabrication 4. Microengraving of KOP (Potasium dihydrogen phosphate) crystal by laser microablation 5. Micro and nano cleaning of thin and ultrathin layers need for production of microelectronics devices production.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dumitru Ulieru and Ileana Apostol "New processing possibilities of materials by micro and nano precision laser machining for microelectronics applications", Proc. SPIE 5850, Advanced Laser Technologies 2004, (7 June 2005); https://doi.org/10.1117/12.633706
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