You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
8 June 2005Interface strain transfer mechanism and error modification for adhered FBG strain sensor
The application of adhered FBG strain sensor is affected by interface strain transfer and error modification. In his paper, firstly, based on the characterstics of forces and damage, the fundamental hupotheses are given, and the general expression of interface transferring mechanism is derived. After that, united form of the characteristic value-λ for the general equation is geven for the multi-layer coatings. Finally, according to the error-modified equation of adhered FBG sensor, the relationships the error rate η against the shear modulus and the thckness of the glue are given. With regard to the glue applied in engineering (thickness is from 4mm to 60mm, shear modulus is from 30MPa to 200MPa), the error rate η is about 5~10%, and the correction coefficient k is about 1.05~1.11. Hence, the error modification must be considered when adhered FBG strain sensors are used in civil engineering.
Jilong Li,Zhi Zhou, andJinping Ou
"Interface strain transfer mechanism and error modification for adhered FBG strain sensor", Proc. SPIE 5851, Fundamental Problems of Optoelectronics and Microelectronics II, (8 June 2005); https://doi.org/10.1117/12.634066
The alert did not successfully save. Please try again later.
Jilong Li, Zhi Zhou, Jinping Ou, "Interface strain transfer mechanism and error modification for adhered FBG strain sensor," Proc. SPIE 5851, Fundamental Problems of Optoelectronics and Microelectronics II, (8 June 2005); https://doi.org/10.1117/12.634066