12 April 2005 A combined fiber optic digital shearography and holography system for defect inspection in Si-wafers
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Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621526
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore
Abstract
The present work relates to surface and/or subsurface defects inspection system for semiconductor industries and particularly to an inspection system for a defect such as swirl defects and particles in an unpolished silicon wafer before the wafer fabrication process by a combined fiber optic digital shearography and holography technique. The dual purpose camera described in this paper gives the possibility of using either digital shearography or holography (DSPI) techniques depending on application needs. The sub-surface defects in a wafer normally create strain concentrations subjected to loading (stressing) which are translated into anomalies in the fringe pattern. A real time technique with the use of Lab view Express 7 software is developed to detect defects in Si-wafer with the application of thermal oading as a stressing method. The results obtained by applying a real time fiber optic shearography technique are described in this paper. The method described here relates specifically to semiconductor wafers, but may be generalized to any other samples.
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Ganesha Udupa, Ganesha Udupa, Jun Wang, Jun Wang, Bryan Kok Ann Ngoi, Bryan Kok Ann Ngoi, } "A combined fiber optic digital shearography and holography system for defect inspection in Si-wafers", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621526; https://doi.org/10.1117/12.621526
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