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12 April 2005 Electronic speckle pattern interferometry applied to the displacement measurement of sandwich plates with double fully potted inserts
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Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621535
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore
Abstract
The construction of electronic speckle pattern interferometer (ESPI) applied to sandwich plates with double inserts has been presented in this paper. Proposed ESPI has advantages of full-field and non-destructive testing that can measures microscopic out-of-plane displacement in the elastic region and without wasting specimen. For validation purpose, the finite element method (FEM) analysis was conducted. By comparing the results of ESPI and FEM displacement at the center of the specimen that a convincing agreement is revealed, thus showing the effect of spatial interval of the double inserts on the displacement of sandwich plates under loading.
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Song-Jeng Huang and Hwa-Long Lin "Electronic speckle pattern interferometry applied to the displacement measurement of sandwich plates with double fully potted inserts", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621535; https://doi.org/10.1117/12.621535
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