Translator Disclaimer
Paper
12 April 2005 Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
Author Affiliations +
Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621936
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore
Abstract
Residual stresses is measured using a new technique combining hole indentation with Electronic Speckle Pattern Interferometry (ESPI). The technique is superior to conventional methods such as the widely used rosette strain-gage hole drilling technique in the ease of experimental set up and the use of optics in strain measurement allows results to be displayed in real-time. The technique is fast, simple, less destructive and has great potential to be developed into a quality inspection tool in the production/field environment.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. N. Sim, Cho Jui Tay, and L. Cheng "Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); https://doi.org/10.1117/12.621936
PROCEEDINGS
7 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT


Back to Top