12 April 2005 Mechanical properties of lead-free solder alloys evaluated by miniature size specimen
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Proceedings Volume 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; (2005) https://doi.org/10.1117/12.621538
Event: Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, 2004, -, Singapore
Abstract
Tensile and fatigue testing using miniature specimen was proposed to compare the mechanical behaviors of Sn-3.0%Ag-0.5%Cu alloy in small and large volumes respectively. It was found that the tensile strength data of the miniature specimen was not similar with clear inferiority to that of the large volume under all test conditions. The differences in their mechanical properties are attributed to dendrite morphology and intermetallic compounds size. Thus, the mechanical behavior and the solidification microstructure strongly depend on specimen volume, which suggests that small size be used to measure mechanical behaviors of solder alloys.
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Yoshiharu Kariya, Yoshiharu Kariya, Tsuyoshi Asai, Tsuyoshi Asai, Tadatomo Suga, Tadatomo Suga, "Mechanical properties of lead-free solder alloys evaluated by miniature size specimen", Proc. SPIE 5852, Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics, (12 April 2005); doi: 10.1117/12.621538; https://doi.org/10.1117/12.621538
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