13 June 2005 Performance evaluation of a residual stress measurement device using indentation and a radial in-plane ESPI interferometer
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Abstract
A radial in-plane electronic speckle pattern interferometer (ESPI) is used to measure residual stresses in combination with an indentation method. A semi-empirical mathematical model is developed to quantify the residual stresses from the radial in-plane displacement component measurement around the indentation print. Several tests were made in a specimen with different levels of residual stresses induced by mechanical loading. Correlation functions were fitted to tests results and are used to predict the residual stresses levels. This paper briefly presents the measurement principle, testing details and results of the performance evaluation. Finally, an uncertainty budget of the testing and measurement process was carried out. The tests presented here are not complete since they are restricted to only one material, oneaxis stress state, two indentation tip geometry and only one indentation force, but they are sufficient to encourage further development.
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Ricardo Suterio, Ricardo Suterio, Armando Albertazzi G., Armando Albertazzi G., Felipe Kleber Amaral, Felipe Kleber Amaral, Anderson Pacheco, Anderson Pacheco, } "Performance evaluation of a residual stress measurement device using indentation and a radial in-plane ESPI interferometer", Proc. SPIE 5856, Optical Measurement Systems for Industrial Inspection IV, (13 June 2005); doi: 10.1117/12.612615; https://doi.org/10.1117/12.612615
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