16 September 2005 Super-resolution x-ray imaging by CdTe discrete detector arrays
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Abstract
512-pixel CdTe super-liner imaging scanner was developed. This device was consist with 512 chips of M-π-n CdTe diode detector fabricated by excimer laser doping process, 8 chips of photon-counting mode 64ch ASIC with FPGA circuit, USB2.0 interface with 1-CPU. It has 5 discriminated levels and over 2Mcps count rate for X-ray penetration imaging. This imaging scanner has 512 discrete CdTe chips for detector arrays with the length of 2.0mm, width of 0.8mm and thickness of 0.5mm. These chips were mounted in four plover array rows for high-resolution imaging with 0.5mm-pitch, therefore the pixel pitch was over the pixel width. When images were taken with scanning system with this arrays, we could obtain over-resolution than pixel width. In this paper, this "over-resolution" imaging will be called "super resolution imaging". In high-resolution imaging device, the pixel devices on one substrate were formed by integrated process, or many discrete detector chips were installed on circuit board, usually. In the latter case, it is easer to make each detector chips than former case, and it are no need to consider charge sharing phenomena compare with one-chip pixel devices. However, a decrease in pixel pitch makes the mount to the detector chip to the ASIC board difficult because the handling will also be difficult The super-resolution technique in this scanner by pixel-shift method for X-ray imaging is shown in this paper
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T. Aoki, T. Aoki, Y. Ishida, Y. Ishida, H. Morii, H. Morii, Y. Tomita, Y. Tomita, G. Ohashi, G. Ohashi, J. Temmyo, J. Temmyo, Y. Hatanaka, Y. Hatanaka, } "Super-resolution x-ray imaging by CdTe discrete detector arrays", Proc. SPIE 5922, Hard X-Ray and Gamma-Ray Detector Physics VII, 59220T (16 September 2005); doi: 10.1117/12.616887; https://doi.org/10.1117/12.616887
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