Paper
13 September 2005 High thermal stable and low resistance contacts to p-GaN for thin-GaN LED
C. L. Lin, S. J. Wang, C. Y. Liu
Author Affiliations +
Abstract
In this work, we investigate the optical and electrical properties of inserting a Ni thin barrier between contact layer, NiO-Au, and reflective layer, Al after sequent elevated annealing in air ambient. The reflectivity of NiO-Au/Ni/Al p-GaN contact configurations is 61% in 470nm which is 10% higher than NiO-Au/Al p-GaN contact configurations, after 500°C annealing. By inserting a Ni barrier layer, the specific contact resistance of the NiO-Au/Ni/Al was maintained on the order of 10-2 Ω-cm2, up to an annealing temperature of 500°C. The XPS results confirmed the function of the Ni barrier layer, and it shows relatively low atomic level of Al was detected in the GaN epi-layer. It was found that both the electrical and optical characteristics of NiO-Au/Ni/Al p-GaN contacts exhibited good thermal stability. This high thermal stable P-GaN enables the fabrication of thin-GaN LED device.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. L. Lin, S. J. Wang, and C. Y. Liu "High thermal stable and low resistance contacts to p-GaN for thin-GaN LED", Proc. SPIE 5941, Fifth International Conference on Solid State Lighting, 59411M (13 September 2005); https://doi.org/10.1117/12.616349
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Cited by 2 scholarly publications.
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KEYWORDS
Aluminum

Light emitting diodes

Gallium nitride

Nickel

Resistance

Reflectivity

Annealing

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