Laser and optical measurement techniques for characterization of microelectronic components

Milan Držík

doi:10.1117/12.638919

6 December 2006 Laser and optical measurement techniques for characterization of microelectronic components

Milan Držík

Proceedings Volume 5945, 14th Slovak-Czech-Polish Optical Conference on Wave and Quantum Aspects of Contemporary Optics; 59450L (2006) https://doi.org/10.1117/12.638919
Event: 14th Slovak-Czech-Polish Optical Conference on Wave and Quantum Aspects of Contemporary Optics, 2005, Nitra, Slovakia

Abstract

Using of several sophisticated optical techniques is reviewed to test the flatness of semiconductor wafers and to measure thin-film residual stresses, induced by various technological processes. Thin silicon membranes have been also inspected to obtain the membrane tension values and thickness variations. Besides this, experimentally by using of Laser Doppler Vibrometer the dynamics of MEMS microcomponents has been studied, too. In the paper, specific features of the methods, where performances and limitations, together with some remarks, regarding practical experiences of the exploitation, are reported.

Citation Download Citation

Milan Držík "Laser and optical measurement techniques for characterization of microelectronic components", Proc. SPIE 5945, 14th Slovak-Czech-Polish Optical Conference on Wave and Quantum Aspects of Contemporary Optics, 59450L (6 December 2006); https://doi.org/10.1117/12.638919

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