Implications of wafer design for manufacturing practices on photomask manufacturing

Andrew Watts; Jed Rankin; Christopher Magg

doi:10.1117/12.632418

7 November 2005 Implications of wafer design for manufacturing practices on photomask manufacturing

Andrew Watts, Jed Rankin, Christopher Magg

Proceedings Volume 5992, 25th Annual BACUS Symposium on Photomask Technology; 599227 (2005) https://doi.org/10.1117/12.632418
Event: SPIE Photomask Technology, 2005, Monterey, California, United States

Abstract

Focus on Design for Manufacturing (DFM) in semiconductor device design has increased as semiconductor manufacturing technology has become more complex. Many of the techniques developed to improve wafer yield and manufacturability can also be applied to the photomask manufacturing process. For example, for the last several technology nodes, semiconductor manufacturers have known that pattern density and uniformity can have significant impact on wafer processes such as etching and chemical mechanical polishing. Photomask manufacturing can also be impacted by pattern density and its uniformity. Some of these DFM practices can be beneficial if applied directly to photomask manufacturing while some of them can make photomask manufacturing significantly more difficult. Optical proximity correction (OPC), which involves convoluting the design shape to account for optical, physical and chemical processes, is increasingly required to support advanced lithography; some of the operational parameters of the OPC, such as the fragmentation run length, challenge mask resolution capability, image fidelity, defect inspection, mask repair, and dimensional metrology of photomasks. Sub-resolution assist features (SRAFs), which are utilized to create robust wafer lithography are often the most challenging mask features to create. The size and placement of SRAFs on photomasks are factors that impact photomask manufacturability in terms of image resolution, inspection, and dispositioning criteria. As OPC and other DFM processes become more widely deployed in an effort to make robust wafer manufacturing processes, the photomask maker needs to be involved to evaluate the implications to photomask manufacturing and assist in optimizing these DFM procedures to maximally benefit both the photomask and semiconductor manufacturing processes.

Citation Download Citation

Andrew Watts, Jed Rankin, and Christopher Magg "Implications of wafer design for manufacturing practices on photomask manufacturing", Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 599227 (7 November 2005); https://doi.org/10.1117/12.632418

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KEYWORDS

Photomasks

Manufacturing

Optical proximity correction

Semiconducting wafers

Design for manufacturing

Inspection

Image processing

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