Paper
8 November 2005 Advanced e-beam CAR resist evaluation for 65nm generation
Author Affiliations +
Abstract
Chemically amplified resists, CAR, and 50kV e-beam writers have been applied for the most advance mask manufacturing. To fulfill the requirement of 65nm generation a good performance resist played an important role. In this work, two advanced positive and negative CAR resist has been evaluated for 65nm photomask process with a 50kV e-beam pattern generator in an advanced process line. For 65nm node not only the resolution is needed to be improved but also the cirtical dimension(CD) control will be more critical than previous generation. So the evaluation is focus on the CD performance, resolution, profile, e-beam sensitivity, line edge roughness(LER), etc.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gordon Chan, Orson Lin, Wesen Tseng, Booky Lee, Torey Huang, and Makoto Kozuma "Advanced e-beam CAR resist evaluation for 65nm generation", Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 59923B (8 November 2005); https://doi.org/10.1117/12.632052
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KEYWORDS
Critical dimension metrology

Photomasks

Line edge roughness

Photoresist processing

Etching

Edge roughness

Manufacturing

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