8 November 2005 Determination of mask layer stress by placement metrology
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The present paper will show an approach for a local and global stress determination by the application of a Leica LMS IPRO II mask registration tool. Changes in placement due to a full or partial layer removal on single materials as well as material stacks with respect to a reference grid were determined. Simulation using finite element modeling was conducted to calculate stress values from the placement information. Finally, an estimate was made of the acceptable stress level for a sample design to meet placement requirements for future lithography nodes.
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Jörg Butschke, Jörg Butschke, Ute Buttgereit, Ute Buttgereit, Eric Cotte, Eric Cotte, Günter Hess, Günter Hess, Mathias Irmscher, Mathias Irmscher, Holger Seitz, Holger Seitz, "Determination of mask layer stress by placement metrology", Proc. SPIE 5992, 25th Annual BACUS Symposium on Photomask Technology, 59923U (8 November 2005); doi: 10.1117/12.631526; https://doi.org/10.1117/12.631526

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