7 February 2006 The packaging technology of optical switch arrays
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Proceedings Volume 6032, ICO20: MEMS, MOEMS, and NEMS; 60320O (2006) https://doi.org/10.1117/12.667874
Event: ICO20:Optical Devices and Instruments, 2005, Changchun, China
Abstract
Optical switch is one of key supporting technologies in all-optical-network (AON). And electrostatic MOEMS (Micro-Optical-Electro-Mechanical Systems) switch plays a very important role in all the researched switches, because of their excellent features, including low insertion, low crosstalk and scalability. But the packaging technology has been limiting the development of optical switch. In this paper, the authors study the laser beam propagating during the free space and select collimator, design the pedestal to packaging and address aspects of the insertion loss that are most important loss mechanisms for the 2D cross-connect switch.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lina Zhao, Jingqiu Liang, Wei Dong, Anjie Ming, Weihua Lan, Xia Jin, Wangbin Zhu, Weibiao Wang, Zichun Le, Weiyou Chen, Lijun Wang, "The packaging technology of optical switch arrays", Proc. SPIE 6032, ICO20: MEMS, MOEMS, and NEMS, 60320O (7 February 2006); doi: 10.1117/12.667874; https://doi.org/10.1117/12.667874
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