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28 December 2005 Thermal and mechanical responses of the thermomechanical microprobe for high-density storage technology
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This paper investigates the transient heat transfer behavior and doping concentration of the thermomechanical microprobe using the transient finite element method and SUPREM-IV.GS software for the experimental validation. The thermomechanical microprobe is a newly developed high-density data storage technique. Heat management, on the other hand, is an extremely critical issue in high-density data storage application. This study explores the transient heat transfer behavior of the thermomechanical microprobe through measurement and simulation. In order to study this transient heat transfer behavior, a microprobe is fabricated, and the transient finite element method is adopted for optimizing and analyzing the performance of the microprobe. Furthermore, the doping parameter would govern the data writing and reading response of the thermomechanical microprobe. To optimize the microprobe's performance, this paper also utilizes the process simulation software SUPREM-IV.GS as well as the area weighting method to predict the electrical characteristic of the microprobe. The main goal of this research is to develop a ethodology for the required heating/cooling rate to reach the expected temperature which is affected by the different geometric specifications of the cantilever beam structure of the microprobes. Furthermore, this research fabricates the thermomechanical microprobe using complementary metal oxide semiconductor (CMOS)-compatible micromechanical manufacturing technology. The results show that the required time response to reach the designed heating temperature is about a few microseconds for a small-sized heater. Moreover, in terms of temperature cooling status, we find that the larger dimension of a cantilever beam can enhance the heat dissipation from the heater in order for the expected temperature to be reached within the time range of microseconds. In addition, the resistivity of the heater obtained from the simulation prediction based on the SUMPEM-IV.GS and the area weighting method corroborates the experiment data in the literature.
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Chun-Te Lin and Kuo-Ning Chiang "Thermal and mechanical responses of the thermomechanical microprobe for high-density storage technology", Proc. SPIE 6037, Device and Process Technologies for Microelectronics, MEMS, and Photonics IV, 60370R (28 December 2005);

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