21 March 2006 Wavelet-transform-based method of analysis for ultrasonic NDT signals of MMC adhesive interface
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Proceedings Volume 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials; 604018 (2006) https://doi.org/10.1117/12.664214
Event: ICMIT 2005: Merchatronics, MEMS, and Smart Materials, 2005, Chongqing, China
In the ultrasonic non-destructive evaluation (UNDE) of Metal Matrix Composite Structure(MMCs), one problem is that echoes from different interior layers may overlap, causing obscurity or loss of the fault-detection-and-localization information from a particular layer. To address this issue, a wavelet-transform-based approach was adopted to extract features from UNDE data, which in turn were used to estimate the specimen's adhesive properties. Specifically the db3 wavelet (based on the impulse response of the test instrumentation system) was applied to perform the wavelet transform and separate the overlapped echoes. The features thus extracted were found effective in analyzing and identifying the adhesive properties of the specimen concerned. This method of feature extraction is expected to be largely applicable to the UNDE of multi-layer bonded structure.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi Dun, Yi Dun, Xiaohong Shi, Xiaohong Shi, Zhangsui Xu, Zhangsui Xu, Feng Wang, Feng Wang, } "Wavelet-transform-based method of analysis for ultrasonic NDT signals of MMC adhesive interface", Proc. SPIE 6040, ICMIT 2005: Mechatronics, MEMS, and Smart Materials, 604018 (21 March 2006); doi: 10.1117/12.664214; https://doi.org/10.1117/12.664214

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