Paper
5 December 2005 Study of variation of thermal expansion coefficients diffuse by real-time interferometry of holographic
M. Karimi, A.A. Moghadam Saraee
Author Affiliations +
Proceedings Volume 6048, Optomechatronic Actuators and Manipulation; 604808 (2005) https://doi.org/10.1117/12.652755
Event: Optomechatronic Technologies 2005, 2005, Sapporo, Japan
Abstract
Using the real-time holographic interferometry, we have studied the way of variation of thermal expansion coefficient as a function of temperature. For this purpose we have used a particular set-up appropriate to in-situs developing process. In the reconstruction step, the observer will see-through the hologram ,a virtual image which is coincident with the wave diffracted by the object itself, and an interference pattern will appear. If then the temperature of the object is increased, this will cause the movement of fringe. Hype number of displaced fringes give measure to evaluatethe coefficient of the thermal expansion of the object. The corresponding curves is depicted.
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M. Karimi and A.A. Moghadam Saraee "Study of variation of thermal expansion coefficients diffuse by real-time interferometry of holographic", Proc. SPIE 6048, Optomechatronic Actuators and Manipulation, 604808 (5 December 2005); https://doi.org/10.1117/12.652755
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KEYWORDS
Holograms

Holographic interferometry

Holography

Temperature metrology

Interferometry

3D image reconstruction

Chromium

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