Fabrication of phone-camera module using wafer-scale UV embossing process

Dong-Ik Shin; Sung-Kwa Kim; Ho-Seop Jeong; SeokCheon Lee; YoungSu Jin; JungEun Noh; HyeRan Oh; KiUn Lee; Dong Ho Shin; Seok Ho Song

doi:10.1117/12.643461

6 February 2006 Fabrication of phone-camera module using wafer-scale UV embossing process

Dong-Ik Shin; Sung-Kwa Kim; Ho-Seop Jeong; SeokCheon Lee; YoungSu Jin; JungEun Noh; HyeRan Oh; KiUn Lee; Dong Ho Shin; Seok Ho Song

Author Affiliations +

Proceedings Volume 6068, Sensors, Cameras, and Systems for Scientific/Industrial Applications VII; 60680Q (2006) https://doi.org/10.1117/12.643461
Event: Electronic Imaging 2006, 2006, San Jose, California, United States

Abstract

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 230 μm sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

Citation Download Citation

Dong-Ik Shin, Sung-Kwa Kim, Ho-Seop Jeong, SeokCheon Lee, YoungSu Jin, JungEun Noh, HyeRan Oh, KiUn Lee, Dong Ho Shin, Seok Ho Song, "Fabrication of phone-camera module using wafer-scale UV embossing process", Proc. SPIE 6068, Sensors, Cameras, and Systems for Scientific/Industrial Applications VII, 60680Q (6 February 2006); doi: 10.1117/12.643461; https://doi.org/10.1117/12.643461

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