Enhancement of structural stiffness in MEMS structures

Samir Ilias; Francis Picard; Patrice Topart; Carl Larouche; Hubert Jerominek

doi:10.1117/12.648409

23 January 2006 Enhancement of structural stiffness in MEMS structures

Samir Ilias, Francis Picard, Patrice Topart, Carl Larouche, Hubert Jerominek

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Proceedings Volume 6109, Micromachining and Microfabrication Process Technology XI; 610907 (2006) https://doi.org/10.1117/12.648409
Event: MOEMS-MEMS 2006 Micro and Nanofabrication, 2006, San Jose, California, United States

Abstract

Many optical applications require smooth micromirror reflective surfaces with large radius of curvature. Usually when using surface micromachining technology and as a result of residual stress and stress gradient in thin films, the control of residual curvature is a difficult task. In this work, two engineering approaches were developed to enhance structural stiffness of micromirrors. 1) By integrating stiffening structures and thermal annealing. The stiffening structures consist of U-shaped profiles integrated with the mirror (dimension 200×300 μm²). 2) By combining selective electroplating and flip-chip based technologies. Nickel was used as electroplated material with optimal stress values around ±10 MPa for layer thicknesses of about 10 μm. With the former approach, typical curvature radii of about 1.5 cm and 0.6 cm along mirror width and length were obtained, respectively. With the latter approach, an important improvement in the micromirror planarity and flatness was achieved with curvature radius up to 23 cm and roughness lower than 5 nm rms for typical 1000×1000 μm² micromirrors.

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Samir Ilias, Francis Picard, Patrice Topart, Carl Larouche, and Hubert Jerominek "Enhancement of structural stiffness in MEMS structures", Proc. SPIE 6109, Micromachining and Microfabrication Process Technology XI, 610907 (23 January 2006); https://doi.org/10.1117/12.648409

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KEYWORDS

Micromirrors

Mirrors

Aluminum

Silicon

Electroplating

Silicon films

Thin films

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