Technology Review Of High-Speed, Thick-Film Laser Trimming

Alan Cable

doi:10.1117/12.956406

7 July 1986 Technology Review Of High-Speed, Thick-Film Laser Trimming

Alan Cable

Proceedings Volume 0611, Laser Processing of Semiconductors & Hybrids; (1986) https://doi.org/10.1117/12.956406
Event: O-E/LASE'86 Symposium, 1986, Los Angeles, CA, United States

Abstract

Thick-film hybrid circuits continue to dominate the hybrid circuit market because of their design flexibility, power handling capabilities and low production costs. In their simplest form, thick-film circuits consist of high purity alumina substrates with screen printed, fired resistors and conductors. The resistor materials are usually oxides of ruthemium with conductors of platinum/gold, palladium/gold, or palladium/silver.

Citation Download Citation

Alan Cable "Technology Review Of High-Speed, Thick-Film Laser Trimming", Proc. SPIE 0611, Laser Processing of Semiconductors & Hybrids, (7 July 1986); https://doi.org/10.1117/12.956406

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available