5 January 2006 Guidelines for reliability testing of microelectromechanical systems in military applications
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Micro electromechanical systems (MEMS) and microsystems technologies are seeing increased consideration for use in military applications. Assets ranging from aircraft and communications to munitions may soon employ MEMS. In all cases, MEMS devices must perform their required functions for the duration of the equipment's mission profile. Long-term performance in a given scenario can be assured through an understanding of the predominant MEMS failure modes. Once the failure modes have been identified, standardized tests will be developed and conducted on representative devices to detect the potential for these failures. Failure mechanisms for MEMS devices in severe environments may include wear and stiction. While corrosion is not usually a concern for commercial MEMS devices, as they are made primarily of silicon, other materials, including metallics, are being considered for MEMS to provide enhanced robustness in military applications. When these materials are exposed to aggressive military environments, corrosion may become a concern. Corrosion of metallic packaging and interconnect materials may also present issues for overall performance. Considering these corrosion and degradation issues, there is a need to implement standardized tests and requirements to ensure adequate long-term performance of MEMS devices in fielded and emerging military systems. To this end, Concurrent Technologies Corporation has been tasked by the U.S. Army to initiate efforts to standardize test methods that have been developed under previous activities. This paper presents an overview of the MEMS activities under the standardization effort and the MEMS reliability test guidelines that have been drafted as a first phase of this effort.
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Robert Mason, Robert Mason, Larry Gintert, Larry Gintert, Marc Rippen, Marc Rippen, Don Skelton, Don Skelton, James Zunino, James Zunino, Ivars Gutmanis, Ivars Gutmanis, } "Guidelines for reliability testing of microelectromechanical systems in military applications", Proc. SPIE 6111, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V, 61110K (5 January 2006); doi: 10.1117/12.649012; https://doi.org/10.1117/12.649012

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