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23 January 2006 Global flatness of spatial light modulators
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Abstract
The Fraunhofer Institute for Photonic Microsystems (IPMS) Dresden (Germany) has developed a one megapixel SLM device with 512 x 2048 individually addressable tilting micromirrors optimized for micro-lithography applications. Besides many other chip parameters SLM surface planarities strongly determine the pattern performance on the lithography masks. This paper presents results on the so called Global Flatness (GF) of the chips which takes into account the complete active area of the large mirror matrix. A description and definition of GF is presented, followed by measurement results on GF prior to chip packaging. Different adhesives are tested for the die bonding process. Bonding on flat test substrates enables the separation of different influences on GF. Impacts of the topography of the die attach and of die bonding process parameters on GF are investigated, optimization potentials such as different dispense modes are tested and discussed. Influences of the chip layout on GF are evaluated. A transfer of Global Flatness measurements to other large area optical chips, e. g. image sensors, is outlined. In the future GF improvements are expected to gain importance due to the ever increasing requirements on CD and CD uniformity performance of mask writers.
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Michael Wagner, Ulrich Künzelmann, Harald Schenk, and Hubert Lakner "Global flatness of spatial light modulators", Proc. SPIE 6114, MOEMS Display, Imaging, and Miniaturized Microsystems IV, 611404 (23 January 2006); doi: 10.1117/12.644580; https://doi.org/10.1117/12.644580
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